After the embedded board design, we fabricate and assemble PCBA to make prototypes. We have all the required equipment in-house to solder electronic components to a PCB. This is needed for testing and verification of the product. If we find any problem in the prototype, we rectify it. Two or three iterations along embedded product development are basically more than enough to disclose most of the problem. We can assemble SMT, THT and specifically BGA chips, high density PCBs, and can fabricate up to 20 layers multilayer PCB, rigid, rigid-flex, and flex using FR-4, RO4350 and AD450 substrates.
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